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IC FLASH
| Part | Technology | Memory Format | Memory Size | Supplier Device Package | Package / Case | Package / Case [y] | Package / Case [y] | Voltage - Supply [Min] | Voltage - Supply [Max] | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Write Cycle Time - Word, Page | Mounting Type | Memory Organization | Access Time | Memory Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | FLASH - NAND | FLASH | |||||||||||||||
GigaDevice Semiconductor (HK) Limited | FLASH - NAND (SLC) | FLASH | 1024 KB | 48-TSOP I | 48-TFSOP | 18.4 mm | 0.724 in | 2.7 V | 3.6 V | 85 °C | -40 °C | ONFI | 20 ns | Surface Mount | 1 G | 18 ns | Non-Volatile |
GigaDevice Semiconductor (HK) Limited | FLASH - NAND | FLASH | |||||||||||||||
GigaDevice Semiconductor (HK) Limited | FLASH - NAND (SLC) | FLASH | 1024 KB | 63-FBGA (9x11) | 63-VFBGA | 2.7 V | 3.6 V | 85 °C | -40 °C | ONFI | 20 ns | Surface Mount | 1 G | 18 ns | Non-Volatile |