IC FLASH 512MBIT SPI/QUAD 8WSON
| Part | Package / Case | Memory Size | Supplier Device Package | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Memory Format | Memory Type | Memory Organization | Clock Frequency | Technology | Mounting Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case [x] | Package / Case [y] | Write Cycle Time - Word, Page | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 8-WDFN Exposed Pad | 64 MB | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 24-TBGA | 64 MB | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 24-TBGA | 64 MB | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 16-SOIC | 64 MB | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | 0.295 in | 7.5 mm | ||
Winbond Electronics | 16-SOIC | 64 MB | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | 0.295 in | 7.5 mm | ||
Winbond Electronics | 8-WDFN Exposed Pad | 64 MB | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 8-WDFN Exposed Pad | 64 MB | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 24-TBGA | 64 MB | 24-TFBGA (6x8) | DTR QPI Quad I/O SPI | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 1.65 V | 1.95 V | 3 ms | 6 ns | ||
Winbond Electronics | 8-WDFN Exposed Pad | 64 MB | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR | Surface Mount | 2.7 V | 3.6 V | ||||
Winbond Electronics | 16-SOIC | 64 MB | 16-SOIC | DTR QPI Quad I/O SPI | 85 °C | -40 °C | FLASH | Non-Volatile | 64 M | 133 MHz | FLASH - NOR (SLC) | Surface Mount | 1.65 V | 1.95 V | 0.295 in | 7.5 mm | 3 ms | 6 ns |