IC FLASH 32MBIT SPI 75MHZ 8WSON
| Part | Memory Format | Technology | Memory Size | Clock Frequency | Package / Case | Write Cycle Time - Word, Page | Mounting Type | Memory Organization | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Memory Type | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 8-WDFN Exposed Pad | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 8-WSON (8x6) | Non-Volatile | ||
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 8-SOIC | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 8-SOIC | Non-Volatile | 5.3 mm | 0.209 " |
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 16-SOIC | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 16-SOIC | Non-Volatile | 7.5 mm | 0.295 in |
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 8-SOIC | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 8-SOIC | Non-Volatile | 5.3 mm | 0.209 " |
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 16-SOIC | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 16-SOIC | Non-Volatile | 7.5 mm | 0.295 in |
Winbond Electronics | FLASH | FLASH | 32 Gbit | 75 MHz | 8-WDFN Exposed Pad | 3 ms | Surface Mount | 4M x 8 | 85 °C | -40 °C | SPI | 2.7 V | 3.6 V | 8-WSON (8x6) | Non-Volatile |