CONN IC DIP SOCKET ZIF 42POS
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Post | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Type | Type | Type | Pitch - Post | Pitch - Post | Features | Contact Material - Post | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Termination | Contact Finish - Mating | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | Nickel Boron | 1 A | 1.27 µm | 50 µin | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 2.54 mm | 0.1 in | Closed Frame | Beryllium Copper | 42 | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | Solder | Nickel Boron | Beryllium Copper |
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | Gold | 1 A | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 2.54 mm | 0.1 in | Closed Frame | Beryllium Copper | 42 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | Solder | Gold | Beryllium Copper | ||||
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | Tin | 1 A | 5.08 µm | 200 µin | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 2.54 mm | 0.1 in | Closed Frame | Beryllium Copper | 42 | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | 0.1 in | 2.54 mm | Solder | Beryllium Copper |