IC FLASH 512KBIT SPI/DUAL 8USON
| Part | Supplier Device Package | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Memory Interface | Memory Size | Technology | Memory Type | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Memory Organization | Mounting Type | Package / Case | Access Time | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 8-USON (1.5x1.5) | 1.65 V | 3.6 V | 100 MHz | SPI - Dual I/O | 64 kb | FLASH - NOR (SLC) | Non-Volatile | FLASH | 85 °C | -40 °C | 64K x 8 | Surface Mount | 8-XFDFN Exposed Pad | 12 ns | 55 µs | 6 ms | ||
GigaDevice Semiconductor (HK) Limited | 8-SOP | 1.65 V | 3.6 V | 104 MHz | SPI - Dual I/O | 64 kb | FLASH - NOR (SLC) | Non-Volatile | FLASH | 85 °C | -40 °C | 64K x 8 | Surface Mount | 8-SOIC | 6 ns | 150 µs | 6 ms | 3.9 mm | 0.154 in |
GigaDevice Semiconductor (HK) Limited | 8-USON (2x3) | 1.65 V | 3.6 V | 100 MHz | SPI - Quad I/O | 64 kb | FLASH - NOR | Non-Volatile | FLASH | 85 °C | -40 °C | 64K x 8 | Surface Mount | 8-XFDFN Exposed Pad |