32-6518 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish - Post	Contact Material - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Termination	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Features	Pitch - Mating	Pitch - Mating	Mounting Type
Aries Electronics 32-6518-102	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Tin	Beryllium Copper	Gold	200 µin	5.08 µm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-10M	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Tin	Beryllium Copper	Gold	200 µin	5.08 µm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-10E	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Tin	Beryllium Copper	Gold	200 µin	5.08 µm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-111	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Gold	Beryllium Copper	Gold	10 çin	0.25 çm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-11	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Gold	Beryllium Copper	Gold	10 çin	0.25 çm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-10T	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Tin	Beryllium Copper	Gold	200 µin	5.08 µm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole
Aries Electronics 32-6518-10H	DIP	0.6 in	15.24 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	10 çin	0.25 çm	3 A	Tin	Beryllium Copper	Gold	200 µin	5.08 µm	UL94 V-0	Solder	2 x 16	32	Brass	Open Frame	0.1 in	2.54 mm	Through Hole