Beta
⌘K
HEATSINK ALUM NATURAL SMD
| Part | Material Finish | Package Cooled | Material | Power Dissipation @ Temperature Rise | Type | Thermal Resistance @ Natural | Length | Length | Thermal Resistance @ Forced Air Flow | Attachment Method | Width | Width [x] | Shape | Fin Height | Fin Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | Tin | SMD | Copper | 2.3 W | Top Mount | 31 °C/W | 0.5 in | 12.7 mm | 5 °C/W 600 LFM | SMD Pad | 26.16 mm | 1.03 in | Rectangular Fins | 0.4 " | 10.16 mm |
Wakefield-Vette | Tin | SMD | Copper | Top Mount | 31 °C/W | 0.5 in | 12.7 mm | 21 °C/W | SMD Pad | 26.16 mm | 1.03 in | Rectangular Fins | 0.4 " | 10.16 mm |