Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Length | Length | Thermal Resistance @ Natural | Fin Height [z] | Fin Height [z] | Attachment Method | Material Finish | Material | Width [y] | Width [y] | Shape | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Package Cooled | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | 0.71 " | 18.03 mm | 20.3 °C/W | 12.7 mm | 0.5 in | Bolt On PC Pin | Black Anodized | Aluminum | 0.955 in | 24.26 mm | Rectangular Fins | 2 W 40 °C | 4 °C/W | TO-220 | Board Level |