Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Contact Material - Post | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Type | Contact Material - Mating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Current Rating (Amps) | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | UL94 V-0 | 200 µin | 5.08 µm | 125 °C | -65 ░C | Solder | Beryllium Copper | 2.54 mm | 0.1 in | Tin | 30 Áin | 0.76 Ám | Closed Frame | PGA ZIF (ZIP) | Beryllium Copper | 3.18 mm | 0.125 in | Gold | 1 A | Through Hole |