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CONN IC DIP SOCKET ZIF 44POS TIN
| Part | Termination Post Length | Termination Post Length | Features | Housing Material | Pitch - Post | Pitch - Post | Mounting Type | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Material - Post | Current Rating (Amps) | Termination | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Through Hole | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper | 1 A | Solder | 44 Positions or Pins | 5.08 µm | 200 µin | Tin | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 200 µin | 5.08 µm | |
Aries Electronics | 0.11 in | 2.78 mm | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Through Hole | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Nickel | Beryllium Nickel | 1 A | Solder | 44 Positions or Pins | 1.27 µm | 50 µin | Nickel Boron | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 50 µin | 1.27 µm | Nickel Boron |