IC FLASH 16MBIT SPI/QUAD 8WLCSP
| Part | Memory Format | Access Time | Operating Temperature [Max] | Operating Temperature [Min] | Memory Interface | Supplier Device Package | Mounting Type | Memory Size | Technology | Voltage - Supply [Max] | Voltage - Supply [Min] | Package / Case | Memory Organization | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Clock Frequency | Memory Type | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | FLASH | 6 ns | 85 °C | -40 °C | QPI Quad I/O SPI | 8-WLCSP | Surface Mount | 16 Mb | FLASH - NOR (SLC) | 2 V | 1.65 V | 8-XFBGA WLCSP | 2 M | 60 µs | 2.4 ms | 133 MHz | Non-Volatile | ||
GigaDevice Semiconductor (HK) Limited | FLASH | 6 ns | 85 °C | -40 °C | QPI Quad I/O SPI | 8-USON (3x2) | Surface Mount | 16 Mb | FLASH - NOR (SLC) | 2 V | 1.65 V | 8-XFDFN Exposed Pad | 2 M | 60 µs | 2.4 ms | 133 MHz | Non-Volatile | ||
GigaDevice Semiconductor (HK) Limited | FLASH | 6 ns | 85 °C | -40 °C | QPI Quad I/O SPI | 8-SOP | Surface Mount | 16 Mb | FLASH - NOR (SLC) | 2 V | 1.65 V | 8-SOIC | 2 M | 60 µs | 2.4 ms | 133 MHz | Non-Volatile | 3.9 mm | 0.154 in |
GigaDevice Semiconductor (HK) Limited | FLASH | 6 ns | 125 °C | -40 °C | QPI Quad I/O SPI | 8-USON (3x2) | Surface Mount | 16 Mb | FLASH - NOR (SLC) | 2 V | 1.65 V | 8-XFDFN Exposed Pad | 2 M | 100 µs | 4 ms | 133 MHz | Non-Volatile |