108387-0059
ActiveIronwood Electronics
SOCKET-EMMC/UFS, 153 BGA 10.0 MM
Deep-Dive with AI
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108387-0059
ActiveIronwood Electronics
SOCKET-EMMC/UFS, 153 BGA 10.0 MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 108387-0059 |
|---|---|
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 153 |
| Number of Positions or Pins (Grid) [custom] | 13 |
| Number of Positions or Pins (Grid) [custom] | 12 |
| Pitch - Mating | 0.02 in |
| Pitch - Mating | 0.5 mm |
| Pitch - Post | 0.02 in |
| Pitch - Post | 0.5 mm |
| Termination | Solder |
| Type | BGA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bag | 2 | $ 531.00 | |
| 12 | $ 518.00 | |||
| 22 | $ 505.00 | |||
| 50 | $ 492.00 | |||
Description
General part information
108387-0059
153 (12 x 13) Pos BGA Socket Through Hole
Documents
Technical documentation and resources
No documents available