EVSC800-PI-2-K6
ActiveCR Technology
THERMAL INSULATION PAD
Deep-Dive with AI
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EVSC800-PI-2-K6
ActiveCR Technology
THERMAL INSULATION PAD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | EVSC800-PI-2-K6 |
|---|---|
| Color | Gray |
| Material | Silicone |
| Outline [x] | 305 mm |
| Outline [y] | 305 mm |
| Thermal Conductivity | 1.1 W/m-K |
| Thickness | 0.16 mm |
| Thickness | 0.0063 " |
| Type | Ultra Thin Dielectric Sheet |
| Usage | Multi |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Sheet | 1 | $ 48.00 | |
| 5 | $ 43.00 | |||
| 10 | $ 38.00 | |||
| 25 | $ 33.00 | |||
| 50 | $ 28.00 | |||
Description
General part information
EVSC800-PI-2-K6
Thermal Pad Gray 305.00mm x 305.00mm
Documents
Technical documentation and resources