SP1-200X100-G
ActiveBusBoard Prototype Systems
200X100MIL UNPLATED HOLE,SIZE1
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SP1-200X100-G
ActiveBusBoard Prototype Systems
200X100MIL UNPLATED HOLE,SIZE1
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SP1-200X100-G |
|---|---|
| Board Thickness | 1.6 mm |
| Board Thickness | 0.063 in |
| Circuit Pattern | Pad Per Hole (Rectangular) |
| Hole Diameter [diameter] | 0.79 mm |
| Hole Diameter [diameter] | 0.031 in |
| Material | FR4 Epoxy Glass |
| Pitch [x] | 2.54 mm |
| Pitch [x] | 0.1 in |
| Plating | Non-Plated Through Hole (NPTH) |
| Proto Board Type | Breadboard, Surface Mount |
| Size / Dimension [x] | 80 mm |
| Size / Dimension [x] | 3.15 in |
| Size / Dimension [y] | 1.79 " |
| Size / Dimension [y] | 45.5 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bag | 1 | $ 3.94 | |
Description
General part information
SP1-200X100-G
Breadboard, Surface Mount Non-Plated Through Hole (NPTH) Pad Per Hole (Rectangular) 0.100" (2.54mm)
Documents
Technical documentation and resources