Zenode.ai Logo
Beta
K
CC6001031AP - CC60L2031

CC6001031AP

Active
Canfield Technologies

60SN/40PB NO CLEAN 1 LB .031 DIA

Deep-Dive with AI

Search across all available documentation for this part.

CC6001031AP - CC60L2031

CC6001031AP

Active
Canfield Technologies

60SN/40PB NO CLEAN 1 LB .031 DIA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationCC6001031AP
CompositionSn60Pb40 (60/40)
Flux TypeNo-Clean
FormSpool
Form1 lb
Form453.59 g
Melting Point [custom]363 °F
Melting Point [custom]184 °C
ProcessLeaded
Shelf Life24 Months
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature [Max]40 °C
Storage/Refrigeration Temperature [Min]10 °C
TypeWire Solder
Wire Gauge20 AWG, 22 SWG

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeySpool 1$ 42.38

Description

General part information

CC6001031AP

Leaded No-Clean Wire Solder Sn60Pb40 (60/40) 20 AWG, 22 SWG Spool, 1 lb (453.59g)

Documents

Technical documentation and resources

No documents available